The Development of High-Accuracy Warpage Analysis CAE for Large, Thin Plastic Parts
[SAE 2005 World Congress & Exhibition]
This paper presents an improved CAE method for high-accuracy warpage analysis. The physical properties of the materials that affect warpage are examined, considering the mechanisms at work in each of the three steps of the injection molding process: injection, pressure holding, and cooling/ejection. When a theoretical mechanism is not fully understood and measurements are inaccurate, correction is made based on the measurement values of large, thin parts. This paper describes both the analysis and application from more than two years of study using the new CAE method.